首页> 外国专利> PRODUCTION METHOD OF A SINGLE THIN FILM FOR A NONDESTRUCTIVE SENSOR, CAPABLE OF IMPROVING THE STABILITY AND UNIFORMITY OF THE THICKNESS OF THIN FILM

PRODUCTION METHOD OF A SINGLE THIN FILM FOR A NONDESTRUCTIVE SENSOR, CAPABLE OF IMPROVING THE STABILITY AND UNIFORMITY OF THE THICKNESS OF THIN FILM

机译:用于非破坏性传感器的单薄膜的生产方法,能够提高薄膜厚度的稳定性和均匀性

摘要

PURPOSE: A production method of a single thin film for a nondestructive sensor is provided to prevent the unevenness of electroplating deposition thickness of a main pattern by using an Electroplating.;CONSTITUTION: A main pattern(80) and a dummy pattern(90) are designed so that they are formed on a wafer substrate(70). An electroplating is performed according to the shape on a wafer substrate. It is confirmed whether the thickness of a deposited thin film is uniform or not after plating. The dummy patterns are formed at three kind of 3mm,5mm, and 7mm according to the outside of the main pattern. The plating is performed at DC pulsed mode.;COPYRIGHT KIPO 2010
机译:目的:提供一种用于无损传感器的单层薄膜的生产方法,以防止通过电镀产生的主要图案的电镀沉积厚度不均。;构成:主要图案(80)和虚拟图案(90)设计成使其形成在晶片衬底(70)上。根据晶片基板上的形状进行电镀。确认镀敷后所沉积的薄膜的厚度是否均匀。虚设图案根据主图案的外部形成为3mm,5mm和7mm三种。电镀以直流脉冲模式进行。; COPYRIGHT KIPO 2010

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