METHOD AND AN APPARATUS FOR MANUFACTURING A PRINTED CIRCUIT BOARD, CAPABLE OF IMPROVING DEGREE OF MATCHING BETWEEN A CONTACT HOLE AND A PAD

摘要

PURPOSE: A method and an apparatus for manufacturing a printed circuit board are provided to improve degree of matching of an exposure process by correcting exposure position data according to position information of a contact hole.;CONSTITUTION: A substrate(100) includes an insulation layer(110a,110b), a conductive layer(150), and a photosensitive layer(160). A contact hole is formed on the insulation layer. The photosensitive layer is formed on the conductive layer. The first position data corresponds to the position of the contact hole. The second position data corresponds to the position of the pad. The position correction data corresponds to an error between the first position data and the second position data. The photosensitive pattern is formed by performing an exposure process and a development process on the photosensitive layer based on the position correction data. The pad is formed along the photosensitive pattern.;COPYRIGHT KIPO 2010