THINNED SEMICONDUCTOR WAFER FORMING A RING SUPPORTING STRUCTURE, AND A METHOD OF THINNING A SEMICONDUCTOR WAFER

摘要

PURPOSE: A thinned semiconductor wafer and a method of thinning a semiconductor wafer are provided to form a ring supporting structure suitable for thinning a wafer and reduce operation cost by forming the ring supporting structure including a lip which includes an edge making the surface of the wafer non-vertically.;CONSTITUTION: A thinned semiconductor wafer and a method of thinning a semiconductor wafer comprise a grinder(200), and a grinding wheel(202). The grinder is programmed in order to move the grinding wheel. The grinding wheel rotates at the direction marked by an arrow(204) while the surface of the semiconductor wafer(150) is pressurized. The boundary of a cavity(166) is set by a step edge(158) and a boundary surface(170).;COPYRIGHT KIPO 2010