ANALYSIS METHOD OF CONTAMINATION INGREDIENT IN THE BULK OF WAFER

摘要

PURPOSE: a kind of metal contamination level of the chip in analysis contamination meter body area is provided directly to cut the chip by analysis component to assessing each bulk region. ;CONSTITUTION: there is chip the semiconductor devices completed to have prepared (S100). Sample of the preparation for analysis passes through the cutting chip (S110). Body regions are examined the sample of cut surface for analyzing (S130). Sample is cut in every piece of area of block analysis for analyzing (S140). ;The 2010 of copyright KIPO submissions