ULTRA WIDE BAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME, CAPABLE OF THE ELECTRICAL TRANSMISSION OF THE HIGH SPEED LARGE CAPACITY SIGNAL AND MICRO WAVE SIGNAL

摘要

PURPOSE: An ultra-wideband system on package and manufacturing method thereof use the trough line and the signal via consisting of the slap line. The discontinuity of the signal created in perpendicular transition is reduced.;CONSTITUTION: A first integrated circuit is located on surface the package body. The first signal transmission means is connected to the first integrated circuit. A signal via(16) is connected to the first signal transmission means. The signal via is composed of a slap line(17) and a trough line(18). The second signal transmission means is connected to the signal via.;COPYRIGHT KIPO 2010