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ELECTRONIC ELEMENT EMBEDDED PRINTED CIRCUIT BOARD CAPABLE OF EASILY AND RELIABILITY INSTALLING AN ELECTRONIC ELEMENT WITH AN ELECTRODE WHICH IS NOT PROJECTED TO THE OUTSIDE AND A MANUFACTURING METHOD THEREOF
ELECTRONIC ELEMENT EMBEDDED PRINTED CIRCUIT BOARD CAPABLE OF EASILY AND RELIABILITY INSTALLING AN ELECTRONIC ELEMENT WITH AN ELECTRODE WHICH IS NOT PROJECTED TO THE OUTSIDE AND A MANUFACTURING METHOD THEREOF
PURPOSE: An electronic element embedded printed circuit board and a manufacturing method thereof are provided to efficiently utilize both sides of PCB by arranging an electrode of electronic element toward an upper side and a lower side.;CONSTITUTION: A first circuit pattern is formed in one-side of a first metal layer(S110). The first metal layer is compressed in a first insulator(S120). A first conductive protrusion is formed by selectively etching the other side of the first metal layer(S130). The conductive adhesive layer is formed in the upper side of the first conductive protrusion. A first electric component is formed in the conductive adhesive layer(S140). A second circuit pattern is formed in one-side of a second metal layer(S150). The second metal layer is compressed in the first insulator(S160). A third circuit pattern is formed by selectively etching the other side of the second metal layer(S170).;COPYRIGHT KIPO 2010
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