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METHOD AND A SYSTEM FOR COLLECTING DATA IN A SEMICONDUCTOR MANUFACTURING FACILITY, CAPABLE OF RAPIDLY SENSING A PROBLEM BY REPORTING THE DATA AT EACH STEP
METHOD AND A SYSTEM FOR COLLECTING DATA IN A SEMICONDUCTOR MANUFACTURING FACILITY, CAPABLE OF RAPIDLY SENSING A PROBLEM BY REPORTING THE DATA AT EACH STEP
PURPOSE: A method and a system for collecting data in a semiconductor manufacturing facility is provided to minimize damage to a wafer by rapidly recognizing the problem with a work result by the reported data after the process is completed.;CONSTITUTION: A wafer is inputted to a process unit(S20). A process is performed(S30). The process is completed(S40). The process unit collects data about the wafer for each process unit and reports the data to a host server(S50). Whether the wafer is inputted to the following unit is checked(S60). The wafer is discharged(S70).;COPYRIGHT KIPO 2010
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