PROBE CARD AND THE MANUFACTURING METHOD THEREOF FOR IMPROVING THE ALIGNMENT OF THE PROBE PINS BY INSERTING PROBE PINS IN THE VIA HOLE OF THE PROBE SUBSTRATE EN-BLOC

摘要

PURPOSE: It forms into the material having the coefficient of thermal expansion which the probe card and manufacturing method thereof are similar the probe substrate in which the probe pin is inserted to wafer. The pad position secession of the probe pin due to the heat expansion rate between the probe card and wafer are prevented.;CONSTITUTION: The supporting plate(10) is combined on the main circuit substrate(40). It is formed into the material having the coefficient of thermal expansion which the supporting plate is similar to wafer. The probe substrate(20) comprises the circuit pattern in inside. The probe substrate comprises the circuit pattern and electrically connected a plurality of via hole. The circuit pattern of the probe substrate is electrically connected to the main circuit substrate.;COPYRIGHT KIPO 2010