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HEAD FOR CHIP MOUNTER HAVING HIGH SPEED ACTIVITY

机译:高速贴片机头

摘要

PURPOSE: A head for a chip mounter having high speed activity is provided to improve the high speed activity of the head by mounting a seta motor in a head frame. CONSTITUTION: A head block(20) is installed in a head frame(10). The head block comprises at least one head nozzle(22). The head frame is installed in an X-axis of an element mounting unit. A theta motor(50) is fixed to the head frame. The theta motor rotates the head nozzle. A ball spline(30) is connected to the theta motor. The ball spline transfers the torque of the theta motor to the head block. A coupling pulley(40) is installed in the ball spline. The coupling pulley is varied according to the ball spline.
机译:目的:提供一种具有高速活动性的芯片安装器的头,以通过将Seta电动机安装在头架中来改善头的高速性。组成:头架(20)安装在头架(10)中。头块包括至少一个头喷嘴(22)。头架安装在元件安装单元的X轴上。 θ马达(50)固定在头架上。 θ马达旋转头喷嘴。球花键(30)连接到theta电动机。球花键将θ电机的扭矩传递到缸体。滚珠花键中装有一个联轴器皮带轮(40)。联轴器皮带轮根据滚珠花键而变化。

著录项

  • 公开/公告号KR20100085450A

    专利类型

  • 公开/公告日2010-07-29

    原文格式PDF

  • 申请/专利权人 SAMSUNG TECHWIN CO. LTD.;

    申请/专利号KR20090004737

  • 发明设计人 KIM SEONG KU;

    申请日2009-01-20

  • 分类号H05K13/04;H05K13/02;H05K13;

  • 国家 KR

  • 入库时间 2022-08-21 18:32:10

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