MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE EQUIPPED WITH THE FUSE BOX EXPOSING THE BONDING PAD WITHOUT THE SEPARATE ADDITIONAL PROCESS

摘要

PURPOSE: A manufacturing method of a semiconductor device equipped with a fuse box is provided to prevent electrostatic defect of the fuse box by protecting an open region of the fuse box through an adhesive layer.;CONSTITUTION: Fuse region and bonding pad region are formed in a semiconductor substrate(200). A fuse box including a fuse(210) is formed in the fuse region. A bonding pad is formed in the bonding pad region. An insulating layer(220) equipped with an opening respective exposing the fuse and the bonding pad is formed. A lamination tape for back grind process is attached to the front side of a semiconductor substrate including an insulating layer. The back side of the semiconductor substrate is ground.;COPYRIGHT KIPO 2011