首页> 外国专利> VACUUM INSULATOR WITH REDUCED EFFECTIVE THERMAL CONDUCTIVITY COEFFICIENT AND A FILLER FOR THE SAME

VACUUM INSULATOR WITH REDUCED EFFECTIVE THERMAL CONDUCTIVITY COEFFICIENT AND A FILLER FOR THE SAME

机译:有效导热系数降低的真空绝缘子和相同的填料

摘要

PURPOSE: A vacuum insulator and a filler for the same are provided to minimize the heat transfer through lattice structures in the vacuum insulator by filling a porous filler in the lattice structures.;CONSTITUTION: A vacuum insulator comprises first and second lattice structures(100,200), a porous filler, and first and second plates(300a,300b). The first and second lattice structures are arranged in parallel and comprise upper and lower beams(120,220,110,210) and pillar beams(130,230) vertically connecting the corners of the lattice structures. The porous filler is filled in the spaces formed by the lattice structures. The first and second plates are arranged on the exterior of the first and second lattice structures. The second lattice structure is attached to the upper side of the first lattice structure so that the pillar beams of the second lattice structure are arranged across those of the first lattice structure.;COPYRIGHT KIPO 2011
机译:目的:提供一种真空绝缘子和用于该绝缘子的填料,通过在晶格结构中填充多孔填料,减少通过真空绝缘子中的晶格结构的热传递。;组成:真空绝缘子包括第一和第二晶格结构(100,200) ,多孔填料以​​及第一和第二板(300a,300b)。第一和第二格子结构平行布置,并且包括上下梁(120,220,110,210)和垂直连接格子结构的拐角的支柱梁(130,230)。多孔填料填充在由格子结构形成的空间中。第一和第二板布置在第一和第二格子结构的外部。第二晶格结构附着到第一晶格结构的上侧,从而第二晶格结构的柱梁横穿第一晶格结构的柱梁。; COPYRIGHT KIPO 2011

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