SEMICONDUCTOR PACKAGE AND A METHOD FOR FABRICATING THEREOF, CAPABLE OF IMPROVING THE CONTACT FAIL DUE TO THE DIFFERENCE OF THERMAL EXPANSION COEFFICIENTS BETWEEN A SUBSTRATE AND AN ENCAPSULANT

摘要

PURPOSE: A semiconductor package and a method for fabricating thereof are provided to improve the reliability of solder joint by forming a stress release layer on a semiconductor substrate.;CONSTITUTION: A semiconductor package comprises a substrate(110), a semiconductor chip(150), a stress release layer(170), and an encapsulant(190). The semiconductor chip is laminated on one side of the substrate. The stress release layer covers one side of the substrate and the semiconductor chip. The stress release layer is formed with an elastic body and silicon. The encapsulant is formed on the stress release layer in order to cover one side of the substrate including the semiconductor chip. The stress release layer and the encpasulant are combined with each other through an adhesive.;COPYRIGHT KIPO 2011