PURPOSE: A light emitting diode device reversely attached to a printed circuit board is provided to improve heat radiation effect by directly connecting the lower side of a light emitting diode to the upper side of a heat sink.;CONSTITUTION: A light emitting diode device includes a light emitting diode lens(200), a light emitting chip(210), a heat sink(300), a central support unit(310), a protection space(320), and a coupling unit(330). The printed circuit board has a lens hole(110). In a light emitting diode chip, a lead line is attached to the lower side of the printed circuit board. The heat sink is attached to the lower side of the printed circuit board. A central support unit is attached to the light emitting diode chip. The protection space prevents the lead line from directly contacting with the heat sink. A coupling unit couples the printed circuit board with the heat sink and is separated from the end of the lead line.;COPYRIGHT KIPO 2010
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