首页> 外国专利> LIGHT EMITTING DIODE DEVICE REVERSELY ATTACHED TO A PRINTED CIRCUIT BOARD, CAPABLE OF PROTECTING A LEAD LINE FROM AN EXTERNAL IMPACT

LIGHT EMITTING DIODE DEVICE REVERSELY ATTACHED TO A PRINTED CIRCUIT BOARD, CAPABLE OF PROTECTING A LEAD LINE FROM AN EXTERNAL IMPACT

机译:发光二极管装置应始终安装在印刷电路板上,能够保护外部影响的铅线

摘要

PURPOSE: A light emitting diode device reversely attached to a printed circuit board is provided to improve heat radiation effect by directly connecting the lower side of a light emitting diode to the upper side of a heat sink.;CONSTITUTION: A light emitting diode device includes a light emitting diode lens(200), a light emitting chip(210), a heat sink(300), a central support unit(310), a protection space(320), and a coupling unit(330). The printed circuit board has a lens hole(110). In a light emitting diode chip, a lead line is attached to the lower side of the printed circuit board. The heat sink is attached to the lower side of the printed circuit board. A central support unit is attached to the light emitting diode chip. The protection space prevents the lead line from directly contacting with the heat sink. A coupling unit couples the printed circuit board with the heat sink and is separated from the end of the lead line.;COPYRIGHT KIPO 2010
机译:目的:提供一种反向连接到印刷电路板上的发光二极管器件,以通过将发光二极管的下侧直接连接到散热器的上侧来改善散热效果。组成:发光二极管器件包括发光二极管透镜(200),发光芯片(210),散热器(300),中央支撑单元(310),保护空间(320)和耦合单元(330)。印刷电路板具有透镜孔(110)。在发光二极管芯片中,引线附接到印刷电路板的下侧。散热器安装在印刷电路板的下侧。中央支撑单元附接到发光二极管芯片。保护空间可防止导线直接与散热器接触。耦合单元将印刷电路板与散热器耦合,并与引线末端分开。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR100948401B1

    专利类型

  • 公开/公告日2010-03-22

    原文格式PDF

  • 申请/专利权人 SUK JU HAN;

    申请/专利号KR20090033399

  • 发明设计人 LEE JU HYUNG;BANG EUN A;SUK JU HAN;

    申请日2009-04-17

  • 分类号H01L33/48;

  • 国家 KR

  • 入库时间 2022-08-21 18:31:26

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