首页> 外国专利> PALLADIUM COMPLEX COMPOUND AND SOLUTION FOR ENSURING CATALYTIC PROPERTIES, CONTAINING IT

PALLADIUM COMPLEX COMPOUND AND SOLUTION FOR ENSURING CATALYTIC PROPERTIES, CONTAINING IT

机译:包含钯的络合物和确保催化性能的溶液

摘要

The object is to provide a technique for forming a selective metal coating film on a non-conductive resin by allowing a catalyst metal to adsorb selectively onto an anionic group (e.g., a carboxyl group) on the resin. Thus, disclosed are: a palladium complex represented by the formula (I) below or a structural isomer thereof; a catalyst-imparting treatment solution for electroless plating, comprising the palladium complex or the isomer as an active ingredient; and a method for formation of a metal plating coating film on a non-conductive resin, comprising the steps of subjecting a non-conductive resin having an anionic group formed on its surface to a catalyst-imparting treatment with the catalyst-imparting treatment solution and then performing reduction treatment, electroless metal plating and electrolytic plating. (I) wherein L represents an alkylene group; and R represents an amino group or a guanidyl group.
机译:目的是提供一种通过使催化剂金属选择性地吸附在树脂上的阴离子基团(例如羧基)上而在非导电树脂上形成选择性金属涂膜的技术。因此,公开了以下式(I)表示的钯络合物或其结构异构体。一种用于化学镀的赋予催化剂的处理液,其特征在于,以钯络合物或异构体为有效成分。以及在非导电性树脂上形成金属镀膜的方法,其包括以下步骤:用所述赋予催化剂的处理溶液对在其表面上形成有阴离子基团的非导电性树脂进行催化剂赋予处理;然后进行还原处理,化学镀和电镀。 (I)其中L代表亚烷基; R表示氨基或胍基。

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