MOISTURE AIR curable hot melt adhesive with increasing time delay before bonding

摘要

The invention relates to humidity reactive hot melt adhesive compounds which contain at least one isocynate group exhibiting polyurethane prepolymer, P1, which is liquid at room temperature, as well as at least one linear polyurethane, P2, which is solid at room temperature and which contains polycaprolactone segments, exhibits hydroxyl groups, and exhibits a melting viscosity of 100-300 Pa.s at 170 DEG C. The compounds are particularly characterized by an extended open time.