Electrical device e.g. transistor, connecting method for use with printed circuit board in vehicle, involves applying temperature level on board as part of manufacturing process for activating adhesive and connecting area of device

摘要

The method involves applying adhesive to a designated side of a printed circuit board, where the adhesive is designed as adhesive paste. The adhesive is applied in an inactive condition and is activated above temperature level. Another temperature level is applied on the printed circuit board as part of manufacturing process e.g. soldering procedure and gush soldering procedure, for activating the adhesive and connecting area of an electrical device e.g. transistor and resistor, with the board. An independent claim is also included for a method for manufacturing an electrical circuit apparatus.