Device for manufacturing wafers made of mono crystalline ingots, comprises ingots that are cut to cylindrical disks which are transversely divided by ultrasonic sound in wafers, where disks are provided with annular grooves at outer edge

摘要

The device comprises ingots that are cut to cylindrical disks which are transversely divided by an ultrasonic sound in the wafers. The disks are provided with annular grooves at an outer edge, where the ultrasonic probes engage in the grooves for a cleavage process. The grooves are formed with a wire saw, where the separating probes are formed in the form of inverse circular segments. The separation takes place by a time controlled ultrasound excitation of the separation probes.