Method for external phase examination of re-processable disk-shaped, single crystalline substrate to manufacture semiconductor component, involves orienting light rays and detection device, where unscattered portion does not reach surface

摘要

The method involves scattering scanning light rays (5) during impact of an external phase within a substrate (2). A forward scattered light ray portion (12) is detected by a detection device (6). The scanning light rays and the detection device are oriented such that a main propagation direction (9) of the scanning light rays within the substrate and an observation direction (8) of the detection device within the substrate run together under a dispersion detection angle (theta). An unscattered light-ray portion (13) does not reach a receiving surface (11) of the detection device.