Method for inspecting existence of sawing grooves on wafers utilized for manufacturing solar cells, involves evaluating wafer based on images of partial region at short exposure time

摘要

The method involves projecting a light line on a wafer (1) by a laser light source, and transporting the wafer on a transport device. The wafer is inspected during continuous transport of the wafer, where the wafer is arranged on the transport device such that sawing grooves (2, 3) are aligned at a right-angle to a transportation direction. A partial region of the wafer is examined such that images of the partial region are recorded using a surface camera. The wafer is evaluated based on each image of the surface camera at short exposure time of 100 microseconds. An independent claim is also included for a device for inspecting existence of sawing grooves on wafers for solar cells.