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A method for producing a a contactless and an interface with contacts of the chip card having

机译:一种用于制造具有芯片的触点的非接触和接口的方法,该芯片卡具有

摘要

The invention relates to a method for producing a a contactless and having a contact interface chip card, which also is known as a dual interface chip card.A fundamental idea of the invention is to be seen, in the case of a dual interface chip card (10) a reliable electrical connection between an antenna (30) and a chip module (50) to produce, as described in the case of chip cards, which only have an interface with contacts, it is possible to. A further aspect is to be seen in the manufacturing process of dual interface chip cards to be optimized. For this purpose, the card body (20) is no longer of individual, prefabricated laminated layers are assembled, but rather by layers (20a, 20b) which, during the completion of the chip card (10) with the use of suitable methods, for example a 3 - d - manufacturing methods, be produced layer by layer.
机译:本发明涉及一种用于制造非接触并具有接触接口芯片卡的方法,该方法也被称为双接口芯片卡。在双接口芯片卡的情况下,本发明的基本思想是可见的。 10)在天线(30)和芯片模块(50)之间的可靠的电连接,以产生如芯片卡的情况所描述的,其仅具有与触点的接口。在待优化的双接口芯片卡的制造过程中将看到另一方面。为此,卡体(20)不再是单独的预制层压层,而是由层(20a,20b)组装,在使用合适的方法完成芯片卡(10)的过程中,例如3-d-制造方法,可以逐层生产。

著录项

  • 公开/公告号DE102009014343A1

    专利类型

  • 公开/公告日2010-09-23

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE20091014343

  • 发明设计人

    申请日2009-03-21

  • 分类号G06K19/00;

  • 国家 DE

  • 入库时间 2022-08-21 18:28:20

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