Shielding device for multi-layer printed circuit board, has electrically conductive spring supported inside side walls of shielding housing and attached to contact surface by elastic prestress

摘要

The device has a container-like shielding housing (1) in which a multi-layer printed circuit board is arranged. An earthing layer is connected with the housing using multiple contacts in a conductive manner. A contact surface i.e. metallization, is arranged on a front surface of the board and connected with the earthing layer in an electrically conductive manner. An electrically conductive spring is supported inside side walls (3) of the housing. The spring is attached to the contact surface by elastic prestress.