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manufacturing method for acoustic volumenwellen resonator using the internal mechanical tension of a layer of metal, and thus manufactured resonator

机译:利用金属层的内部机械张力的容积型谐振器的制造方法,从而制造出谐振器

摘要

PURPOSE: A method for fabricating FBAR by using internal stress of a metal layer without using an additional holder and a resonator fabricated thereby are provided to separate a piezoelectric resonance structure as much as a predetermined height from a substrate by generating the stress to the top direction in a process for depositing a lower electrode layer. CONSTITUTION: A sacrificial layer is stacked on a semiconductor substrate(100). A predetermined region is removed from the semiconductor substrate in order to form an electrical contact between a signal line of the semiconductor substrate and a lower electrode layer(120). A metal layer is deposited on the sacrificial layer. The lower electrode layer is formed by patterning the metal layer. A piezoelectric material is deposited on the lower electrode layer. A piezoelectric layer(130) is formed by patterning the piezoelectric material. A metal layer is deposited on the piezoelectric layer. An upper electrode layer(140) is formed by patterning the metal layer.
机译:用途:通过使用金属层的内部应力而无需使用额外的支架来制造FBAR的方法,以及由此提供的谐振器,其通过在顶部方向上产生应力而将压电谐振结构与基板分开预定高度。在沉积下电极层的过程中。构成:牺牲层被堆叠在半导体衬底(100)上。从半导体衬底去除预定区域,以便在半导体衬底的信号线和下电极层(120)之间形成电接触。金属层沉积在牺牲层上。通过对金属层进行图案化来形成下电极层。压电材料沉积在下电极层上。通过对压电材料进行构图来形成压电层(130)。在压电层上沉积金属层。通过对金属层进行构图来形成上电极层(140)。

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