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AN ELECTRONIC ORGANISATION CONTAINING A COMPONENT ENGINEER AND A METHOD FOR ESTABLISHING AN ELECTRONIC ORGANISATION

机译:包含组件工程师的电子组织和建立电子组织的方法

摘要

Electronic arrangement (100) comprising a component carrier (110) with a first (111) and a second (112) main surface, in which component carrier a first aperture (120, 130) is arranged, the main direction of which extends from the first main surface towards the second main surface, and an electronic component (150, 160) which is arranged and retained in the aperture. The material of the component carrier (110) has essentially at least the same thermal expansion coefficient as the electronic component (150, 160), and the component carrier (110) can be used to retain the component in the aperture (120, 130). The extent of the aperture (120, 130) is the same as the extent of the component (150, 160) in a direction running between the main surfaces (111, 112) of the component carrier at right angles to the main surfaces. The component is positioned in the carrier (110) in such a manner that the extents of the component and the aperture in said direction coincide. The invention also relates to the component carrier and a method of producing the arrangement.
机译:电子装置(100)包括具有第一主表面(111)和第二主表面(112)的元件载体(110),在元件载体中布置有第一孔(120、130),第一孔(120、130)的主方向从第一孔(120)延伸。第一主表面朝向第二主表面,以及电子部件(150、160),其布置并保持在孔中。部件载体(110)的材料具有与电子部件(150、160)基本上至少相同的热膨胀系数,并且部件载体(110)可用于将部件保持在孔(120、130)中。 。孔(120、130)的范围与部件(150、160)在与主表面成直角的,在部件载体的主表面(111、112)之间延伸的方向上的范围相同。部件以这样的方式定位在载体(110)中,使得部件和孔在所述方向上的范围一致。本发明还涉及部件载体和制造该装置的方法。

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