首页> 外国专利> SILVER POWDER, METHOD FOR PRODUCING THE SAME, RESIN-CURING ELECTROCONDUCTIVE PASTE AND METHOD FOR FORMING ELECTROCONDUCTIVE FILM

SILVER POWDER, METHOD FOR PRODUCING THE SAME, RESIN-CURING ELECTROCONDUCTIVE PASTE AND METHOD FOR FORMING ELECTROCONDUCTIVE FILM

机译:银粉,其制备方法,导电胶的树脂固化方法和导电膜的形成方法

摘要

PROBLEM TO BE SOLVED: To provide a method for forming an electroconductive film having the electric conductivity more excellent than that of the conventional electroconductive film to be formed by using the resin-curing electroconductive paste obtained by the conventional method, a new resin-curing electroconductive paste for obtaining the electroconductive film having more excellent electric conductivity, granular silver powder to be blended in the new resin-curing electroconductive paste, and a method for producing the granular silver powder.;SOLUTION: The granular silver powder is obtained by coating the material silver powder with polyvalent carboxylic acid by 0.01-0.5 mass%. The granular silver powder is blended in the new resin-curing electroconductive paste.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种形成导电膜的方法,该导电膜的导电性比通过使用通过常规方法获得的树脂固化的导电膏形成的常规导电膜的导电性更好,该新型的树脂固化的导电膜用于获得具有更好导电性的导电膜的锡膏,将要混合在新型树脂固化型导电膏中的粒状银粉以及生产粒状银粉的方法。银粉与0.01〜0.5质量%的多元羧酸。颗粒状的银粉被混入新的树脂固化型导电胶中。;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011140714A

    专利类型

  • 公开/公告日2011-07-21

    原文格式PDF

  • 申请/专利权人 DOWA ELECTRONICS MATERIALS CO LTD;

    申请/专利号JP20100274596

  • 发明设计人 KONO YOSHIKO;NOGAMI TOKUAKI;YUKI MASAYA;

    申请日2010-12-09

  • 分类号B22F1/02;B22F1/00;H01B5/00;H01B13/00;H01B1/22;H01B5/14;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:16

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