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DEFECT ESTIMATION DEVICE, DEFECT ESTIMATION METHOD, INSPECTION DEVICE, AND INSPECTION METHOD

机译:缺陷估计装置,缺陷估计方法,检查装置和检查方法

摘要

PROBLEM TO BE SOLVED: To provide a defect estimation device and a defect estimation method for estimating a defect on a mask, the influence of the defect on a wafer and the degree of improvement by repair, and to provide an inspection device and an inspection method for facilitating a defect determination processing and for estimating a defect on a mask and the resultant influence on a wafer image.SOLUTION: The acquired mask data of the defect portion of mask inspection results 205 is sent to a simulated repair circuit 300 to be simulatedly repaired. The acquired mask data simulatedly repaired is returned to the mask inspection results 205 again and thereafter sent to a wafer transfer simulator 400 along with a reference image at the corresponding portion. Wafer transfer images estimated by the wafer transfer simulator 400 are sent to a comparing circuit 301 and, when it is determined that there is a defect, the coordinate and the wafer transfer image as a basis for the defect determination are stored as transfer image inspection results 206. The mask inspection results 205 and the transfer image inspection result 206 are sent to a review device 500.
机译:解决的问题:提供一种缺陷估计装置和缺陷估计方法,用于估计掩模上的缺陷,缺陷对晶片的影响和通过修复的改善程度,并且提供一种检查装置和检查方法解决方案:用于将掩模检查结果205的缺陷部分的掩模数据发送到模拟修复电路300,以进行模拟修复,以便于缺陷确定处理和估计掩模上的缺陷以及由此对晶片图像的影响。 。被模拟修复的所获取的掩模数据再次返回到掩模检查结果205,然后与对应部分处的参考图像一起被发送到晶片转移模拟器400。由晶片传送模拟器400估计的晶片传送图像被发送到比较电路301,并且当确定存在缺陷时,坐标和作为缺陷确定基础的晶片传送图像被存储为传送图像检查结果。 206.掩模检查结果205和转印图像检查结果206被发送给检查装置500。

著录项

  • 公开/公告号JP2011221499A

    专利类型

  • 公开/公告日2011-11-04

    原文格式PDF

  • 申请/专利权人 NUFLARE TECHNOLOGY INC;

    申请/专利号JP20110017294

  • 发明设计人 ABE TAKAYUKI;TSUCHIYA HIDEO;

    申请日2011-01-28

  • 分类号G03F1/08;G01N21/956;G01N23/225;

  • 国家 JP

  • 入库时间 2022-08-21 18:25:17

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