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ELECTROLESS TIN PLATING SOLUTION

机译:无锡镀锡解决方案

摘要

PROBLEM TO BE SOLVED: To provide a method for enhancing the productivity of products by shortening the heat treatment time for preventing generation of a whisker of a tin plating film.;SOLUTION: Electroless tin plating solution contains soluble tin salt, complexing agent and acid, and further contains water-soluble aliphatic alcohol having three or more hydroxyl groups in one molecule (wherein, ether linkage may be contained in the aliphatic group). In a method for manufacturing a plated object having a tin plating film, an object to be plated having copper at least on its surface is immersed in the electroless tin plating solution, and then, subjected to the heat treatment for 40-75 minutes at the condition of a temperature of 110-130°C, and the thickness of a pure tin layer in the obtained tin plating film is controlled to 0.100-0.250 μm.;COPYRIGHT: (C)2011,JPO&INPIT
机译:要解决的问题:提供一种通过缩短热处理时间来防止锡镀膜晶须生成的方法来提高产品生产率的方法。解决方案:化学镀锡溶液包含可溶性锡盐,络合剂和酸,并且进一步包含在一个分子中具有三个或更多个羟基的水溶性脂族醇(其中,在脂族基中可以包含醚键)。在具有镀锡膜的镀覆对象物的制造方法中,将至少在其表面上具有铜的镀覆对象物浸入化学镀锡溶液中,然后在100℃下进行40〜75分钟的热处理。在110-130℃的温度条件下,将所得镀锡膜中纯锡层的厚度控制在0.100-0.250μm。COPYRIGHT:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011184746A

    专利类型

  • 公开/公告日2011-09-22

    原文格式PDF

  • 申请/专利权人 JX NIPPON MINING & METALS CORP;

    申请/专利号JP20100051874

  • 发明设计人 YABE JUNJI;KOBAYASHI HIRONORI;NANBA RUI;

    申请日2010-03-09

  • 分类号C23C18/52;H05K3/18;H05K3/24;H05K3/22;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:47

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