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HOLE-ROUGHNESS QUANTIFICATION DEVICE AND HOLE-ROUGHNESS QUANTIFICATION METHOD

机译:孔粗度量化装置及孔粗度量化方法

摘要

PROBLEM TO BE SOLVED: To provide a hole-roughness quantification device and a hole-roughness quantification method that can quantify roughness speedily and accurately without the need to artificially designate areas which should be quantified, when quantifying the roughness of the hole pattern formed on a photomask, or the like.;SOLUTION: When the roughnesses of measurement target patterns are quantified from a contour line of measurement target patterns and reference patterns, the present invention calculates the difference between positional coordinates of a plurality of points located on the contour line of the measurement target patterns and positional coordinates of a plurality of balls located on the contour line of the reference patterns and calculates the roughness values of the measurement target patterns, based on the difference distance calculated.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种孔粗糙度量化装置和孔粗糙度量化方法,当对形成在孔上的孔图案的粗糙度进行量化时,无需人工指定应量化的区域,就可以快速且准确地量化粗糙度。解决方案:当从测量目标图案和参考图案的轮廓线量化测量目标图案的粗糙度时,本发明计算位于测量轮廓的轮廓线上的多个点的位置坐标之间的差。测量参考图形和位于参考图形轮廓线上的多个球的位置坐标,并根据计算出的差值距离计算测量目标图形的粗糙度值。;版权:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011185793A

    专利类型

  • 公开/公告日2011-09-22

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO LTD;

    申请/专利号JP20100052313

  • 发明设计人 MORINAGA KATSUHISA;

    申请日2010-03-09

  • 分类号G01B15/08;G01B15/04;G01B11/30;G01B11/24;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:36

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