首页> 外国专利> SHEET SUPPLY DEVICE, SUPPLY METHOD, SHEET STICKING DEVICE AND STICKING METHOD

SHEET SUPPLY DEVICE, SUPPLY METHOD, SHEET STICKING DEVICE AND STICKING METHOD

机译:板材供应装置,供应方法,板材粘贴装置及粘贴方法

摘要

PROBLEM TO BE SOLVED: To provide a sheet supply device and a supply method capable of surely separating and supplying an adhesive sheet from a separation sheet, a sheet sticking device and a sticking method capable of efficiently sticking the adhesive sheet to a coating body in a short time.;SOLUTION: When separating and supplying a mount sheet MS as the adhesive sheet by the sheet supply device 3, while vibrating a peel plate 71 by a vibrating body 72, among a delivered original roll R, the separation sheet RL is deflected and carried by the peel plate 71, and the mount sheet MS is separated ad supplied from the separation sheet RL. The sheet sticking device 1 presses and sticks the mount sheet MS separated by the sheet supply device 3 in this way to a wafer W by a pressing roller 4.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种能够可靠地从分离片分离并供给粘合片的片材供给装置和供给方法,能够将粘合片有效地粘合到涂布体中的片材粘合装置和粘合方法。短期:解决方案:当通过片材供应装置3分离并供应作为粘合片的安装片材MS时,在通过振动体72使剥离板71振动的同时,在所输送的原始卷R中,分离片材RL被偏转。剥离片71从剥离片RL供给并从剥离片RL剥离安装片MS。片材粘贴装置1通过压辊4将以这种方式由片材供应装置3分离的安装片材MS按压并粘贴到晶片W上;版权所有:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011011890A

    专利类型

  • 公开/公告日2011-01-20

    原文格式PDF

  • 申请/专利权人 LINTEC CORP;

    申请/专利号JP20090158834

  • 发明设计人 SUGISHITA YOSHIAKI;

    申请日2009-07-03

  • 分类号B65H41/00;B65C9/42;B65C9/26;B65H37/04;H01L21/683;B65C9/18;

  • 国家 JP

  • 入库时间 2022-08-21 18:24:30

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