METHOD OF DETERMINING EXPOSURE AMOUNT, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROGRAM FOR DETERMINING EXPOSURE AMOUNT AND EXPOSURE AMOUNT DETERMINATION DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of determining exposure amount that precisely determines the exposure amount for forming a pattern having desired two-dimensional form parameter on a substrate.;SOLUTION: The method of determining exposure amount includes the steps of: acquiring a mask pattern map where the displacement distribution of the two-dimensional form parameter between the mask pattern formed on a mask and the desired mask pattern is acquired as a mask pattern map (m1); and determining the exposure amount for each position in an exposure shot based on the mask pattern map (m1) so that the displacement of the two-dimensional form parameter between the pattern on a wafer formed when the mask is shot-exposed so as to form the pattern thereon and the same formed on the desired wafer pattern falls within the predetermined range.;COPYRIGHT: (C)2011,JPO&INPIT