Phosphoric acid aqueous solution applying method and apparatus for forming a semiconductor p-n junction layer using an aqueous solution of phosphoric acid

摘要

When forming a p-n junction layer on the P-type surface of the semiconductor silicon substrate, the present invention, even the silicon surface by atomization electrode under conditions of atmospheric pressure and room temperature phosphoric acid aqueous solution in a spray device which is designed specially Through the thermal diffusion was coated on, to form a thickness of 0.2mm~0.8mm phosphorous acid membrane, a method of p-n junction layer is to be formed on the P-type surface of the semiconductor silicon substrate The present invention relates to. Also, a plate 2 for fixing the silicon substrate 1, a transfer apparatus 10 carrying the stage 3 of the plate 2, phosphoric acid aqueous solution coating apparatus for forming a semiconductor p-n junction layer according to the present invention, in the stage 3 wherein the liquid spray head 20 of a pair are disposed to face each other while maintaining a constant angle (θ) located in a vertical upper reciprocated a certain section of the head 20 is mounted on a scanning device 4 configured to spray the aqueous phosphoric acid solution on the surface of the silicon substrate 1 while. [Selection] Figure Figure 1