EPOXY RESIN ADHESIVE COMPOSITION AND ADHESIVE FOR OPTICAL SEMICONDUCTOR USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin adhesive composition which suppresses short wavelength absorption, has excellent light transmission properties, UV resistance, weather resistance, heat resistance, application properties and shelf stability, and can be used for adhesion of an assembly and various components of a semiconductor device mounting a semiconductor chip; and to provide an adhesive for an optical semiconductor using the same.;SOLUTION: The epoxy resin adhesive composition having the excellent light transmission properties contains an alicyclic epoxy compound (A), a silsesquioxane compound (B) containing two or more of any of an epoxy group, an alcoholic hydroxide group and a hydrolytic alkoxysilane group in the terminal of the structure thereof, a silane compound (C) containing a hydrolytic group connected directly to a silicon atom, an organic tin compound (D) to be a mixture of a bivalent organic tin compound (d1) and a tetravalent organic tin compound (d2) and an inorganic filler (E) having ≤0.4 μm average particle diameter of primary particles as indispensable components in respectively specified amounts.;COPYRIGHT: (C)2011,JPO&INPIT