首页> 外国专利> METHOD AND APPARATUS FOR FORMING CORROSION-PREVENTING ELECTRODEPOSITION COATING FILM OF MARINE STEEL STRUCTURE

METHOD AND APPARATUS FOR FORMING CORROSION-PREVENTING ELECTRODEPOSITION COATING FILM OF MARINE STEEL STRUCTURE

机译:海洋钢结构防腐蚀电镀膜的形成方法和装置

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a corrosion-preventing electrodeposition coating film of a marine steel structure, which can surely form the corrosion-preventing electrodeposition coating film having uniform thickness on the surface of the marine steel structure, and to provide an apparatus therefor.;SOLUTION: This film-forming apparatus includes: a reference electrode 6 that measures a potential of the marine steel structure 1 side when an electric current is passed to the marine steel structure by a direct-current power source 4; and also a control device 7 which outputs a control signal 4a for holding the direct-current value when the potential of the marine steel structure 1 side, which has been measured with the reference electrode 6, is within a preset reference electrodeposition potential range, for decreasing the direct-current value when the potential 6a of the marine steel structure 1 side, which has been measured with the reference electrode 6, is in the preset reference electrodeposition potential range or lower, and on the other hand, for increasing the direct-current value when the potential 6a of the marine steel structure 1 side, which has been measured with the reference electrode 6, is in the preset reference electrodeposition potential range or higher, to the direct-current power source 4.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种形成船用钢结构的防腐蚀电沉积涂膜的方法,该方法能够可靠地在船用钢结构的表面上形成厚度均匀的防腐蚀电沉积涂膜,并提供解决方案:该成膜装置包括:参比电极6,当通过直流电源4向船用钢结构传递电流时,该参比电极6测量船用钢结构1侧的电势。另外,控制装置7在由基准电极6测定的船用钢结构1侧的电位在预先设定的基准电沉积电位范围内时,输出用于保持直流值的控制信号4a。当用参考电极6测量的船用钢结构1侧的电势6a在预设参考电沉积电势范围内或更低时,减小直流值;另一方面,为了增加直流电,用参考电极6测量的船用钢结构1侧的电势6a在预设参考电沉积电势范围内或更高时的直流电流电流值;;版权:(C) 2011,日本特许厅

著录项

  • 公开/公告号JP2011111626A

    专利类型

  • 公开/公告日2011-06-09

    原文格式PDF

  • 申请/专利权人 IHI CORP;

    申请/专利号JP20090265922

  • 申请日2009-11-24

  • 分类号C23F13/00;E04G23/02;E02B3/06;

  • 国家 JP

  • 入库时间 2022-08-21 18:22:03

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