首页> 外国专利> RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE ORIGINAL PLATE FOR LASER ENGRAVING, MANUFACTURING METHOD OF THE SAME, RELIEF PRINTING PLATE, AND PLATE MAKING METHOD OF THE SAME

RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE ORIGINAL PLATE FOR LASER ENGRAVING, MANUFACTURING METHOD OF THE SAME, RELIEF PRINTING PLATE, AND PLATE MAKING METHOD OF THE SAME

机译:激光雕刻用树脂组合物,激光雕刻用浮雕印刷版原版,相同的制造方法,浮雕印刷版及相同的制版方法

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for laser engraving by which a relief printing plate excellent in a rinsing property of engraving waste generated during laser engraving and excellent in the elasticity and ink transferring property of the formed relief layer can be obtained.;SOLUTION: The resin composition for laser engraving includes (a) a compound represented by one of formulae (1) to (4) and (b) a binder polymer. Here, R1 represents a bonding group, R2 to R6 independently represent monovalent organic groups respectively, A represents a (m+n)valent organic bonding group, k represents an integer of 0 to 4, m represents an integer of 1 to 4, n represents an integer of 1 to 4.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种用于激光雕刻的树脂组合物,通过该组合物可以获得在激光雕刻过程中产生的雕刻废料的漂洗性能优异并且所形成的浮雕层的弹性和油墨转移性优异的凸版印刷板。解决方案:用于激光雕刻的树脂组合物包含(a)式(1)至(4)之一表示的化合物和(b)粘合剂聚合物。在此,R 1 表示键合基团,R 2 至R 6 分别独立地表示一价有机基团,A表示a(m + n)价有机键合基团,k表示0至4的整数,m表示1至4的整数,n表示1至4的整数;版权:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011068031A

    专利类型

  • 公开/公告日2011-04-07

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20090221150

  • 发明设计人 SUGAZAKI ATSUSHI;HITOMI SEIICHI;

    申请日2009-09-25

  • 分类号B41N1/12;B41C1/05;C08L101/00;C08K5/5317;C08K5/42;C08K5/10;C08K5/06;C08G77/22;

  • 国家 JP

  • 入库时间 2022-08-21 18:21:26

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