THERMAL STRESS-CUTTING DEVICE AND THERMAL STRESS-CUTTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thermal stress-cutting device and a thermal stress-cutting method which need no previous formation of an initial crack by another process and has a reduced working process.;SOLUTION: The thermal stress-cutting device 10 is structured of a local heat source 11, stress generating members 13a, 13b, and support parts 15a, 15b. The local heat source 11 is for heating locally a desired region along a predetermined cutting line 17 on a first main face side of a work 12 constituted of the first main face and a second main face formed opposite to the first main face. The stress generating members 13a, 13b are arranged with a contact face on an edge containing the predetermined position for initiating a crack of the work 12. The support parts 15a, 15b interpose the work and the stress generating members from the direction perpendicular to the contact face between the work 12 and the stress generating members 13a, 13b, and support the work 12 and the stress generating members 13a, 13b while pressing these to the direction perpendicular to the contact face S.;COPYRIGHT: (C)2011,JPO&INPIT