Concatenating the resin make hollow package and its production manner for the digital single-lens reflex camera, and semiconductor equipment and the island for digital single-lens reflex camera

摘要

The island for moistureproofing which is the plate shaped structure which is provided in lower part of the semiconductor device on-board aspect of the resin make hollow package is included, the area of the semiconductor device on-board aspect is above 200mm2, at the same time, the maximum height above rail level wave of waviness curve of the semiconductor device on-board aspect is 35 millimicrons or less, the resin make hollow package is offered. The resin make hollow package of this invention, because the island for moistureproofing is included, is superior in resistance to moisture. In addition, because it is superior in even characteristic of the semiconductor device on-board aspect, when the resin make hollow package of this invention is used for the digital single-lens reflex camera and the like which uses the large-sized solid state image sensor, decrease of the peripheral light intensity of the photographing picture is little making use of the wide angle lens. With production method of the resin make hollow package of this invention, by the fact that it inserts forms when the island for moistureproofing is locked making use of the projection which is provided in the die, it prevents the gap of the island for moistureproofing, the resin make hollow package of 35 millimicrons or less can obtain the maximum height above rail level wave of the semiconductor device on-board aspect.