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Si circuit die, method of manufacturing Si circuit die, method of attaching Si circuit die to heat sink, circuit package and power module
Si circuit die, method of manufacturing Si circuit die, method of attaching Si circuit die to heat sink, circuit package and power module
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机译:硅电路芯片,硅电路芯片的制造方法,将硅电路芯片附接到散热器的方法,电路封装和功率模块
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摘要
The present invention relates to a circuit, an integrated circuit package and methods for attaching integrated circuit dies or discrete power components to flanges of integrated circuit packages, wherein each of said integrated circuit dies is sawed from a wafer. The invention comprises reducing the thickness of said wafer by mechanical grinding, applying an isotropic wet chemical etching to said wafer to eliminate crystal defects, evaporating adhesion and diffusion barrier metals on the backside of said wafer, evaporating Au and Sn on the backside of the wafer, wherein the weight proportion of Au is equal to or larger than 85%, sawing the wafer into said circuit dies, and soldering each of said circuit dies to a respective flange of an integrated circuit package. IMAGE
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