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CLEANING DEVICE FOR SOLDER PRINTING MASK, SOLDER PRINTER, AND CLEANING METHOD FOR SOLDER PRINTING MASK

机译:焊锡膏的清洗装置,焊锡打印机和焊锡膏的清洗方法

摘要

PROBLEM TO BE SOLVED: To provide: a cleaning device for a solder printing mask, which can sufficiently clean a lower surface of the mask even if a paper member-pressing portion moves onto a projection portion on the lower surface of the mask; a solder printer; and a cleaning method for the solder printing mask.;SOLUTION: The cleaning device for the solder printing mask is characterized in that a pair of paper member-pressing portions 22 extending upward having lower ends fixed to a nozzle portion 21 to be moved relatively to the mask 4 and disposed opposite in a relative movement direction of the nozzle portion 21 for the mask 4 to press a paper member 24 against the lower surface of the mask 4 include a plurality of tongue piece portions 22f which are arranged in a direction orthogonal to the relative movement direction of the nozzle portion 21 for the mask 4, and can freely tilt independently of one another in the relative movement direction of the nozzle portion 21 for the mask 4.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:提供一种用于焊料印刷掩模的清洁装置,该清洁装置即使纸构件按压部移动到掩模的下表面的突出部上,也能够充分清洁掩模的下表面。焊锡打印机解决方案:用于焊料印刷掩模的清洁装置的特征在于,一对向上延伸的纸构件按压部22具有固定在喷嘴部21上的下端,以相对于其移动。掩模4在喷嘴部21的相对移动方向上相对设置,以使掩模4将纸构件24压靠在掩模4的下表面上,该多个舌片部分22f沿与玻璃板4正交的方向排列。面罩4的喷嘴部分21的相对运动方向,并且可以在面罩4的喷嘴部分21的相对运动方向上彼此独立地自由倾斜;版权:(C)2011,JPO&INPIT

著录项

  • 公开/公告号JP2011091183A

    专利类型

  • 公开/公告日2011-05-06

    原文格式PDF

  • 申请/专利权人 PANASONIC CORP;

    申请/专利号JP20090242997

  • 发明设计人 TANAKA TETSUYA;

    申请日2009-10-22

  • 分类号H05K3/34;B41F35/00;

  • 国家 JP

  • 入库时间 2022-08-21 18:19:50

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