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Laser irradiation area monitoring apparatus, laser irradiation area monitoring method, laser processing apparatus, and laser processing method

机译:激光照射区域监视装置,激光照射区域监视方法,激光处理装置以及激光处理方法

摘要

PROBLEM TO BE SOLVED: To provided a monitoring device capable of monitoring the oxidation of a irradiation region of a laser beam of a work. SOLUTION: A control part 7 is provided with a temperature data calculation part 73 calculating the temperature of the laser beam irradiation region R of the laser beam LB of the work W based on a strength ratio data of a first beam component and a second beam component, a storage part 75 storing previously in a plurality a temperature data based on two light components different in wavelength out of an infrared ray IR thermally radiated, and previously storing a strength data of the first beam component constituting each strength ratio data of a plurality of temperature data, an extraction part 76 selecting the closest temperature data to the temperature data from the storage part 75 based on the temperature data, and extracting the strength data of the first beam component in the selected temperature data, and a decision part comparing the strength data of the extracted first beam component and the first beam component strength data of the irradiation region R.
机译:解决的问题:提供一种能够监视工件的激光束的照射区域的氧化的监视装置。解决方案:控制部件7具有温度数据计算部件73,该温度数据计算部件73基于第一光束分量和第二光束分量的强度比数据来计算工件W的激光束LB的激光束照射区域R的温度。在存储部75中,预先存储基于热辐射的红外线IR中波长不同的两个光成分的多个温度数据,并预先存储构成多个光强度的各强度比数据的第一光束成分的强度数据。温度数据,提取部76基于温度数据从存储部75选择与温度数据最接近的温度数据,并提取所选择的温度数据中的第一光束成分的强度数据,以及比较强度的判定部提取的第一光束分量的数据和照射区域R的第一光束分量强度的数据。

著录项

  • 公开/公告号JP4689093B2

    专利类型

  • 公开/公告日2011-05-25

    原文格式PDF

  • 申请/专利权人 浜松ホトニクス株式会社;

    申请/专利号JP20010199208

  • 发明设计人 松本 聡;

    申请日2001-06-29

  • 分类号B23K26;B23K26/03;G01J5;G01N33/20;

  • 国家 JP

  • 入库时间 2022-08-21 18:18:48

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