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Method of manufacturing connecting electronic components, as well as the method of manufacturing a connection device using the connection for electronic components

机译:制造连接电子部件的方法以及使用该电子部件连接件的连接装置的制造方法

摘要

PROBLEM TO BE SOLVED: To provide an electronic part for connection or the like achieving a structure capable of appropriately vacuum chucking the electronic part for connection onto a tip part of a mount nozzle by properly forming a surface of a base plate used for the electronic part for connection.;SOLUTION: An area D capable of facing a hole formed at tip part of a mount nozzle is formed on a surface 8c of an insulation sheet 8, and an elastic deformable part 6 is arranged in the area D. By this, the electronic part for connection 10 can be surely vacuum chucked by the mount nozzle, and such a structure that the tip part of the mount nozzle does not damage the elastic deformable part 6 can be achieved.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种用于连接等的电子部件,该结构通过适当地形成用于电子部件的基板的表面,从而实现能够适当地将用于连接的电子部件真空吸附到安装喷嘴的尖端部分上的结构。解决方案:解决方案:在绝缘片8的表面8c上形成能够面对在安装喷嘴的尖端部分上形成的孔的区域D,并且在区域D中布置有弹性可变形部分6。能够可靠地通过安装喷嘴真空吸附用于连接的电子部件10,并且能够实现一种结构,使得安装喷嘴的尖端部分不会损坏弹性可变形部件6。版权所有:(C)2007,JPO&INPIT

著录项

  • 公开/公告号JP4638785B2

    专利类型

  • 公开/公告日2011-02-23

    原文格式PDF

  • 申请/专利权人 アルプス電気株式会社;

    申请/专利号JP20050210055

  • 发明设计人 吉田 信;添田 薫;

    申请日2005-07-20

  • 分类号H01R13/24;H01R43/20;

  • 国家 JP

  • 入库时间 2022-08-21 18:18:36

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