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Silicone resin composition and its use, a silicone resin, a silicone resin-containing structure, and the optical semiconductor element encapsulation material

机译:硅酮树脂组合物及其用途,硅酮树脂,含硅酮树脂的结构以及光半导体元件密封材料

摘要

PPROBLEM TO BE SOLVED: To provide a silicone resin composition which can maintain transparency and is excellent in sulfur resistance, a method for using the same, a silicone resin, a silicone resin-containing structure, and an optical semiconductor device sealed body. PSOLUTION: The silicone resin composition includes a component (A): a polysiloxane having at least two alkenyl groups each combined with a silicon atom, a component (B): a polysiloxane crosslinking agent having at least two hydrogen groups each combined with a silicon atom, a component (C): a hydrosilylation reaction catalyst, and a component (D): a zinc compound. The component (D) is contained in an amount of 0.1-5 pts.mass based on 100 pts.mass of the sum of the component (A) and the component (B). PCOPYRIGHT: (C)2011,JPO&INPIT
机译:

要解决的问题:为了提供可以保持透明性并且耐硫性优异的硅树脂组合物,其使用方法,硅树脂,含硅树脂的结构和光半导体装置密封体。 。

溶液:硅氧烷树脂组合物包括组分(A):至少两个烯基各自与硅原子结合的聚硅氧烷,组分(B):至少两个氢基各自结合的聚硅氧烷交联剂硅原子,成分(C):氢化硅烷化反应催化剂,成分(D):锌化合物。基于组分(A)和组分(B)的总和的100点质量,组分(D)的含量为0.1-5点质量。

版权:(C)2011,日本特许厅&INPIT

著录项

  • 公开/公告号JP4788837B2

    专利类型

  • 公开/公告日2011-10-05

    原文格式PDF

  • 申请/专利权人 横浜ゴム株式会社;

    申请/专利号JP20100239781

  • 发明设计人 齋木 丈章;武井 吉仁;石川 和憲;

    申请日2010-10-26

  • 分类号C08L83/07;C08L83/05;C08K5/098;C08K3/18;C08K5/55;C08K5/521;C08K5/3467;C08K5/01;H01L23/29;H01L23/31;H01L33/56;

  • 国家 JP

  • 入库时间 2022-08-21 18:18:04

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