首页> 外国专利> Transparent conductive substrate, manufacturing method thereof, transparent coating layer forming coating solution used in the manufacturing method, and display device to which transparent conductive substrate is applied

Transparent conductive substrate, manufacturing method thereof, transparent coating layer forming coating solution used in the manufacturing method, and display device to which transparent conductive substrate is applied

机译:透明导电性基板,其制造方法,在该制造方法中使用的形成透明涂层的涂布液,以及应用了透明导电性基板的显示装置

摘要

A transparent conductive layered structure which has the functions of preventing electrostatic charging or shielding an electric field, and preventing reflection, the two-layered film of which has an excellent scratch strength, and with which a reduction in production cost is expected and a method of producing the same, and a transparent coat layer forming coating liquid used in the method of producing the same, and a display device to which the transparent conductive layered structure is applied, are provided. A transparent conductive layered structure of the present invention, comprises a transparent substrate and a transparent two-layered film being composed of a and a transparent coat layer being formed in succession on the transparent substrate, wherein the transparent conductive layer comprises, as its main components, conductive microparticles having a mean particle diameter of 1 to 100 nm and a binder matrix of silicon oxide, and wherein the transparent coat layer comprises, as its main component, a binder matrix of silicon oxide including one or more types of alkyl groups selected from long chain alkyl groups containing 7 to 30 carbon atoms.
机译:一种透明导电层结构,其具有防止静电电荷或屏蔽电场以及防止反射的功能,其两层膜具有优异的耐刮擦强度,并且期望其生产成本降低。本发明提供一种用于制造透明涂层的透明导电层状结构的显示装置,其制造方法中使用的形成透明涂层的涂布液以及用于显示装置。本发明的透明导电层结构,包括透明基板和由a组成的透明两层膜,并在该透明基板上依次形成透明涂层,其中,该透明导电层包含其主要成分。 ,平均粒径为1〜100nm的导电性微粒和氧化硅的粘合剂基质,其中透明涂层包含作为主要成分的氧化硅的粘合剂基质作为主成分,该氧化物基质包括选自以下的一种或多种类型的烷基:含有7至30个碳原子的长链烷基。

著录项

  • 公开/公告号JP4788852B2

    专利类型

  • 公开/公告日2011-10-05

    原文格式PDF

  • 申请/专利权人 住友金属鉱山株式会社;

    申请/专利号JP20000224500

  • 发明设计人 東福 淳司;行延 雅也;

    申请日2000-07-25

  • 分类号H01B5/14;B32B7/02;B32B17/06;C09C1;C09C1/62;C09C3/06;C09D5/24;C09D7/12;C09D183;H01B1/20;H01B1/22;H01B5;H05B33/28;

  • 国家 JP

  • 入库时间 2022-08-21 18:18:04

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