Heat-dissipating cured coating film, coating composition, method for producing heat-dissipating cured coating film, and electronic device having heat-dissipating cured coating film

摘要

It is made of a cured polymer containing a thermally conductive particle powder having a particle diameter of 10 μm or more and a ratio of particles of 10% by weight or more and an emissivity of 0.5 or more, and is cured by the thermally conductive particles. Fine unevenness is formed on the entire film surface, and the coating film surface is an uneven surface. The maximum height of the uneven surface (however, the maximum height is the difference between the highest height and the minimum height of the uneven surface. The heat dissipation is 10 μm or more, the thickness of the cured coating film at the convex portion is 2000 μm or less, and the thermal conductivity of the cured coating film is 0.4 W / m · K or more. A cured coating film, a coating composition capable of easily forming the heat radiating coating film, a method for producing the heat radiating cured coating film, and an electronic device having the heat radiating cured coating film.