Content of the inorganic filler 30 volume above 75 volume

摘要

PPROBLEM TO BE SOLVED: To provide a photosensitive organic-inorganic composite material which is superior in temperature cycle reliability and a semiconductor device. PSOLUTION: The photosensitive organic-inorganic composite material consists of a photosensitive resin and an inorganic filler, wherein a content of the inorganic filler is ≥30 vol.% and 75 vol.%, the inorganic filler, preferably, has a scale-like or plate-like shape, a maximum particle diameter of ≤50 μm and an aspect ratio of 4-50, and the inorganic filler is dispersed in the resin, in such a way that it is stacked in layers without causing secondary aggregation. The semiconductor device using the composite material is also provided. PCOPYRIGHT: (C)2009,JPO&INPIT