Hardenable resin composition and the hardening ones, and printed circuit board

摘要

The hardenable resin composition whose it is possible to improve the dry to touch characteristic and coating characteristic after the drying, and hardening ones which use this, the printed circuit board is offered. The hardenable resin composition is the hardenable resin composition which contains lactic acid ester, the carboxyl group content resin, and the photo polymerization initiator. We are diluted by viscosity 0.1 - 250dPa s with this lactic acid ester, on the baseplate where the minute hole is formed to the surface, it applies, we dry that hardenable resin composition and, make the coating film form, we are possible to produce hardening ones, or the printed circuit board which have pattern furthermore by exposure developing and hardens.