Being even process manner

摘要

PROBLEM TO BE SOLVED: To solve a problem wherein warpage or waviness parts remain in a conventional method of applying flat processing to a silicon wafer by means of grinding.;SOLUTION: A liquidity adhesive 26 is applied to a substrate 18 and a raw material wafer 19 in a warpage sliced from an ingot is placed on the coated adhesive to obtain a composite wafer 27. In the case of curing the liquidity adhesive 26, an external stimulus (e.g. ultrasonic vibration) is given to the liquidity adhesive 26. After the liquidity adhesive 26 is cured, the exposed face of the raw material wafer 19 is ground to be made flat. Further, the rear side is also ground to obtain the wafer 19b whose both sides are made flat. Through the provision of the external stimulus, the liquidity adhesive 26 is cured in a state of adapting itself to a deformed state of the raw material wafer 19 so that a force is not activated to correct the deformed state of the raw material wafer 19. Then, when the wafer 19a is separated from the substrate 18, the new occurrence of a warpage to the wafer 19a is suppressed.;COPYRIGHT: (C)2006,JPO&NCIPI