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The photoelectricity air integration wiring substrate and the photoelectricity air integration wiring

机译:光电空气集成布线基板和光电空气集成布线

摘要

PPROBLEM TO BE SOLVED: To provide an optoelectric integrated wiring board in which electric connection and optical connection with an optical waveguide are both simply and efficiently performed, in arranging electronic circuit components and light receiving/emitting elements on the wiring board. PSOLUTION: The optoelectric integrated wiring board includes: a substrate having a first face and a second face; a first electric wiring layer; a first resin insulation layer; a second electric wiring layer; and a second resin insulation layer, wherein at least one of the first and second resin insulation layers has an optical wiring layer composed of a transparent resin while the first and second resin insulation layers have an equal thickness. The wiring board also includes a through hole penetrating the substrate vertically and an optical path conversion mirror which, at the position of the through hole opening, is capable of mutually converting a light travelling direction between the vertical direction and the intra-plane direction of the substrate. PCOPYRIGHT: (C)2009,JPO&INPIT
机译:

要解决的问题:提供一种光电集成布线板,其中在布线板上布置电子电路组件和光接收/发射元件时,既简单又有效地进行了与光波导的电连接和光连接。

解决方案:光电集成布线板包括:具有第一面和第二面的基板;以及具有第一面和第二面的基板。第一电布线层;第一树脂绝缘层;第二电布线层;第二树脂绝缘层,其中,第一和第二树脂绝缘层中的至少一个具有由透明树脂构成的光学配线层,而第一和第二树脂绝缘层具有相等的厚度。布线板还包括垂直穿透基板的通孔和光路转换镜,该光路转换镜在通孔开口的位置处能够在光的垂直方向和平面内方向之间相互转换光的传播方向。基质。

版权:(C)2009,日本特许厅&INPIT

著录项

  • 公开/公告号JP4698728B2

    专利类型

  • 公开/公告日2011-06-08

    原文格式PDF

  • 申请/专利权人 京セラ株式会社;

    申请/专利号JP20080330310

  • 发明设计人 小田 恵子;

    申请日2008-12-25

  • 分类号G02B6/122;G02B6/42;H01S5/022;H05K1/02;

  • 国家 JP

  • 入库时间 2022-08-21 18:17:14

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