PROBLEM TO BE SOLVED: To provide an ultrasonic soldering device which has an ultrasonic soldering iron as a heating means having a good heat efficiency capable of drastically reducing the labor of maintenance-cleaning, and does not take away heat of a melted solder from an iron tip.;SOLUTION: In the ultrasonic soldering device (100), the iron tip (11) making ultrasonic oscillation is brought into contact with the solder (31) melted by heating, and soldering to a substrate (30) to be soldered is performed by raising wettability by giving ultrasonic oscillation to the melted solder. The device is provided with an infrared heater (20) which emits infrared light (28), collects the emitted infrared light, and irradiates the collected light on the iron tip. The solder is melted by heating by the iron tip heated by infrared light irradiation.;COPYRIGHT: (C)2009,JPO&INPIT
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