Providing with metal thin film formation and the adhesion

摘要

PROBLEM TO BE SOLVED: To provide a shielding film for printed wiring board and its manufacturing method capable of preventing a metal thin-film layer and an adhesive layer from peeling, even if come gas is produced from adhesive and if water contained in the film is evaporated.;SOLUTION: The shielding film 1 for printed wiring board includes the metal thin-film layer 3 comprising an air permeable metal foil and the adhesive layer 4 both provided sequentially on one surface of an insulating layer 2.;COPYRIGHT: (C)2006,JPO&NCIPI