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In the grinding burnisher in order grinds
In the grinding burnisher in order grinds
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机译:在打磨抛光机中打磨
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摘要
PROBLEM TO BE SOLVED: To provide a polishing device capable of removing a processing distortion existing on a back surface of a semiconductor wafer by polishing the back surface thereof with a high polishing efficiency and a high polishing quality and a grinding/polishing machine to which the polishing device is assembled.;SOLUTION: The polishing device 66 is provided with a chuck means 44; and a polishing tool 2. The polishing tool has a polishing means 6 constituted by dispersing an abrasive grain in a felt of which a density is 0.20 g/cm3 or more and a hardness is 30 or more. The substance to be processed is polished by rotating the chuck means and the polishing tool and pressing the polishing means of the polishing tool to the substance to be processed retained by the chuck means.;COPYRIGHT: (C)2002,JPO
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机译:解决的问题:提供一种抛光装置,其能够通过以高抛光效率和高抛光质量抛光半导体晶片的后表面来消除存在于半导体晶片的后表面上的加工变形。解决方案:抛光装置66设有卡盘装置44;抛光装置66具有卡盘装置44。抛光工具具有抛光装置6,该抛光装置6通过将磨料颗粒分散在密度为0.20g / cm 3 Sup>且硬度为30以上的毡中而构成。通过旋转卡盘装置和抛光工具,然后将抛光工具的抛光装置压在卡盘装置所保留的待处理物质上,对要处理的物质进行抛光。; COPYRIGHT:(C)2002,JPO
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