首页> 外国专利> Methods for tailoring the surface topography of a nanocrystalline or amorphous metal or alloy and articles formed by such methods

Methods for tailoring the surface topography of a nanocrystalline or amorphous metal or alloy and articles formed by such methods

机译:定制纳米晶体或非晶态金属或合金的表面形貌的方法以及通过这种方法形成的制品

摘要

Electrochemical etching tailors topography of a nanocrystalline or amorphous metal or alloy, which may be produced by any method including, by electrochemical deposition. Common etching methods can be used. Topography can be controlled by varying parameters that produce the item or the etching parameters or both. The nanocrystalline article has a surface comprising at least two elements, at least one of which is metal, and one of which is more electrochemically active than the others. The active element has a definite spatial distribution in the workpiece, which bears a predecessor spatial relationship to the specified topography. Etching removes a portion of the active element preferentially, to achieve the specified topography. Control is possible regarding: roughness, color, particularly along a spectrum from silver through grey to black, reflectivity and the presence, distribution and number density of pits and channels, as well as their depth, width, size. Processing parameters that have been correlated in the Ni—W system to topography features include, for both the deposition phase and the etching phase of a nanocrystalline surface: duty cycle, current density, deposition duration, plating chemistry, polarity ratio. The relative influence of the processing parameters can be noted and correlated to establish a relationship between values for processing parameters and degree of topography feature. Control can be established over the topography features. Correlation can be made for any such system that exhibits a definite spatial distribution of an active element that bears a predecessor spatial relationship to a desired topography feature.
机译:电化学蚀刻调整了纳米晶体或非晶态金属或合金的形貌,其可以通过包括电化学沉积在内的任何方法来生产。可以使用普通的蚀刻方法。可以通过改变产生物品的参数或蚀刻参数或两者来控制形貌。纳米晶体制品具有包含至少两种元素的表面,其中至少一种是金属,并且其中一种比其他元素更具电化学活性。有源元件在工件中具有确定的空间分布,该空间分布与指定的形貌具有先前的空间关系。蚀刻优先去除有源元件的一部分,以达到指定的形貌。可以控制以下方面:粗糙度,颜色,尤其是从银到灰色到黑色的光谱,反射率以及凹坑和通道的存在,分布和数量密度,以及它们的深度,宽度,大小。对于纳米晶表面的沉积阶段和蚀刻阶段,在Ni-W系统中与形貌特征相关的处理参数包括:占空比,电流密度,沉积持续时间,电镀化学性质,极性比。可以注意到并关联处理参数的相对影响,以建立用于处理参数的值与地形特征度之间的关系。可以建立对地形特征的控制。可以对任何这样的系统进行关联,这些系统表现出活动元素的确定空间分布,该活动元素与所需地形特征具有先前的空间关系。

著录项

  • 公开/公告号US2010282613A1

    专利类型

  • 公开/公告日2010-11-11

    原文格式PDF

  • 申请/专利权人 CHRISTOPHER A. SCHUH;SHIYUN RUAN;

    申请/专利号US20070985569

  • 发明设计人 CHRISTOPHER A. SCHUH;SHIYUN RUAN;

    申请日2007-11-15

  • 分类号C25D5/10;C25F3/02;C25D5/48;

  • 国家 US

  • 入库时间 2022-08-21 18:15:46

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